As the trend in product miniaturization is rapidly growing, electro-mechanical product designers are facing increased pressure to not only design densely populated Printed Circuit Boards but also to package them in tight mechanical enclosures. To meet these evolving requirements, product design teams are relying on rigid-flex circuits to meet their product performance and packaging.
Successful rigid-flex Printed Circuit Board design requires close collaboration between mechanical and electronic design teams in order to communicate information such as design rules & constraints, board shape, layer stack up, bend radius, dimensional control, etc. This integrated approach also helps organizations to significantly cut prototyping costs during early product development.
During this webinar, you will have the opportunity to learn about the new rigid-flex Printed Circuit Board design capability inside SOLIDWORKS PCB and how this functionality can be used in collaboration with SOLIDWORKS to achieve efficient electro-mechanical product packaging.